Guideline Pb-free packaging and assembly processes [CD-Version]
von: PCB and Electronic SystemsBestell-Nr.: ZSG-23039
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Produktinformationen "Guideline Pb-free packaging and assembly processes [CD-Version]"
ZVEI Guideline: "Influencing factors on components and printed circuit boards resulting from the increased thermal requirements of Pb-free packaging and assembly processes"
Fachverband | PCB and Electronic Systems |
Publikationsart | CD |