Pb-free Sn Finishes with low Whisker Propensity Processability Soldering Solder Heat Resistance [CD-
von: Electronic Components and SystemsBestell-Nr.: ZSG-23023
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Produktinformationen "Pb-free Sn Finishes with low Whisker Propensity Processability Soldering Solder Heat Resistance [CD-"
The risk of whisker growth with Sn finishes can be restricted effectively. Recommendations regarding the choice and combination of finishes for connections, including layer thicknesses are given.
| Fachverband | Electronic Components and Systems |
| Publikationsart | CD |