Guideline Pb-free packaging and assembly processes [CD-Version]

von: PCB and Electronic Systems

Bestell-Nr.: ZSG-23039

 

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Produktinformationen "Guideline Pb-free packaging and assembly processes [CD-Version]"

ZVEI Guideline: "Influencing factors on components and printed circuit boards resulting from the increased thermal requirements of Pb-free packaging and assembly processes"

Fachverband PCB and Electronic Systems
Publikationsart CD
 

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