Pb-free Sn Finishes with low Whisker Propensity Processability Soldering Solder Heat Resistance [CD-

von: Electronic Components and Systems

Bestell-Nr.: ZSG-23023

 

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Produktinformationen "Pb-free Sn Finishes with low Whisker Propensity Processability Soldering Solder Heat Resistance [CD-"

The risk of whisker growth with Sn finishes can be restricted effectively. Recommendations regarding the choice and combination of finishes for connections, including layer thicknesses are given.

Fachverband Electronic Components and Systems
Publikationsart CD
 

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